Multi-Layer Structures and Methods for Forming

摘要

An electroplating method that includes: a) contacting a first substrate with a first article, which includes a substrate and a conformable mask disposed in a pattern on the substrate; b) electroplating a first metal from a source of metal ions onto the first substrate in a first pattern, the first pattern corresponding to the complement of the conformable mask pattern; and c) removing the first article from the first substrate, is disclosed. Electroplating articles and electroplating apparatus are also disclosed.

主权项

1. A method for forming a three-dimensional structure, comprising:
(A) forming a plurality of successively formed layers, wherein each successively formed layer comprises at least two materials and is formed on and adhered to a previously formed layer, one of the at least two materials is a structural material and the other of the at least two materials is a sacrificial material, and wherein each successively formed layer defines a successive cross-section of the three-dimensional structure, and wherein the forming of each of the plurality of successively formed layers comprises:
(i) depositing a first of the at least two materials;(ii) depositing a second of the at least two materials;(iii) planarizing the first of the at least two materials and the second of the at least two materials to set a boundary level for the layer; and (B) after the forming of the plurality of successively formed layers, separating at least a portion of the sacrificial material from multiple layers of the structural material to reveal the three-dimensional structure, wherein the forming of each of at least one given layer of the layers additionally comprises planarizing the first of the at least two materials prior to depositing the second of the at least two materials, and wherein during formation of the at least one given layer, the step of depositing the first of the at least two materials comprises depositing a sacrificial material.