Printed circuit board

摘要

A printed circuit board includes a first semiconductor package on a first surface layer of a printed wiring board and a second semiconductor package on a second surface layer where a bus signal is transmitted from the first to the second semiconductor package. A first bus wiring path from a signal terminal on an inner circumference side of the first semiconductor package via a via hole and the second surface layer to a signal terminal on an outer circumference side of the second semiconductor package and a second bus wiring path from a signal terminal on an outer circumference side of the first semiconductor package via the second surface layer and a via hole to a signal terminal on an inner circumference side of the second semiconductor package are provided, thus securing a return current path for a signal current and realizing a high density wiring while suppressing radiation noise.

主权项

1. A printed circuit board comprising:
a first semiconductor package including a first signal terminal group and a second signal terminal group arranged on an outer circumference side with respect to the first signal terminal group; a second semiconductor package including a third signal terminal group and a fourth signal terminal group arranged on an inner circumference side with respect to the third signal terminal group and transmitting a bus signal with the first semiconductor package; and a printed wiring board in which the first semiconductor package is mounted on a first surface layer and the second semiconductor package is mounted on a second surface layer, wherein the first signal terminal group of the first semiconductor package is connected to the third signal terminal group of the second semiconductor package via a first via hole prepared in the printed wiring board and a first bus wiring formed on the second surface layer of the printed wiring board, and wherein the second signal terminal group of the first semiconductor package is connected to the fourth signal terminal group of the second semiconductor package via a second bus wiring formed on the first surface layer of the printed wiring board and a second via hole prepared in the printed wiring board.