LIGHT-CONVERTING CHIP, METHOD FOR MANUFACTURING OF THE LIGHT-CONVERTING CHIP, LIGHT EMITTING DEVICE PACKAGE, LIGHT EMITTING DEVICE PACKAGE STRIP AND METHOD FOR MANUFACTURING LIGHT EMITTING DEVICE PACKAGE

摘要

The present invention relates to a light-converting chip, a method for manufacturing the light-converting chip, a light emitting device package, a light emitting device package strip and a method for manufacturing the light emitting device package. It may include a first light transmission member which is flat and has a first length; a light conversion material which is formed in the center part of the upper side of the light transmission member and has a second length shorter than the first length; and a second light transmission member which surrounds the upper side of the light conversion material and the edge of the upper side of the first light transmission member to seal the light conversion material.