发明名称 |
Electrical component and method of manufacturing the same |
摘要 |
According to one embodiment, an electrical component comprises a substrate, a functional element formed on the substrate, a first layer which includes through holes, and forms a cavity that stores the functional element on the substrate, and a second layer which is formed on the first layer, and closes the through holes. The first layer includes a first film, a second film on the first film, and a third film on the second film. A Young's modulus of the second film is higher than a Young's modulus of the first film and the third film. |
申请公布号 |
US9181081(B2) |
申请公布日期 |
2015.11.10 |
申请号 |
US201313962892 |
申请日期 |
2013.08.08 |
申请人 |
KABUSHIKI KAISHA TOSHIBA |
发明人 |
Obara Kei;Sugizaki Yoshiaki;Shimooka Yoshiaki |
分类号 |
H01L29/84;B81B7/00 |
主分类号 |
H01L29/84 |
代理机构 |
Holtz, Holtz, Goodman & Chick PC |
代理人 |
Holtz, Holtz, Goodman & Chick PC |
主权项 |
1. An electrical component comprising:
a substrate; a functional element formed on the substrate; a first layer which includes through holes and which forms a cavity that stores the functional element on the substrate; and a second layer which is formed on the first layer and which closes the through holes, wherein the first layer covers the functional element and includes a first film, a second film provided on the first film, and a third film provided on the second film, and a Young's modulus of the second film is higher than a Young's modulus of each of the first film and the third film, and wherein a thickness of the second film is larger than a thickness of each of the first film and the third film. |
地址 |
Tokyo JP |