发明名称 不揮発性半導体記憶装置及びその製造方法
摘要 According to one embodiment, a nonvolatile semiconductor memory device includes a plurality of U-shaped memory strings, each of the plurality of U-shaped memory strings including a first columnar body, a second columnar body, and a conductive connection body. The conductive connection body connects the first columnar body and the second columnar body. A plurality of first memory cells are connected in series in the first columnar body and are composed of a plurality of first conductive layers, a first inter-gate insulating film, a plurality of first floating electrodes, a first tunnel insulating film, and a first memory channel layer. The plurality of first floating electrodes are separated from the plurality of first conductive layers by the first inter-gate insulating film. A plurality of second memory cells are connected in series in the second columnar body, similally to the plurality of first memory cells.
申请公布号 JP5808708(B2) 申请公布日期 2015.11.10
申请号 JP20120089421 申请日期 2012.04.10
申请人 株式会社東芝 发明人 澤 敬一
分类号 H01L21/336;H01L21/8247;H01L27/115;H01L29/788;H01L29/792 主分类号 H01L21/336
代理机构 代理人
主权项
地址