发明名称 印刷された温度センサ
摘要 <p>A method of producing a temperature sensing device is provided. The method includes forming at least one silicon layer and at least one electrode or contact to define a thermistor structure. At least the silicon layer is formed by printing, and at least one of the silicon layer and the electrode or contact is supported by a substrate during printing thereof. Preferably, the electrodes or contacts are formed by printing, using an ink comprising silicon particles having a size in the range 10 nanometers to 100 micrometers, and a liquid vehicle composed of a binder and a suitable solvent. In some embodiments the substrate is an object the temperature of which is to be measured. Instead, the substrate may be a template, may be sacrificial, or may be a flexible or rigid material. Various device geometries are disclosed.</p>
申请公布号 JP5806316(B2) 申请公布日期 2015.11.10
申请号 JP20130528807 申请日期 2011.09.13
申请人 发明人
分类号 H01C7/04;G01K7/22;H01C7/02;H01C17/06 主分类号 H01C7/04
代理机构 代理人
主权项
地址