Package substrate and electronic assembly

摘要

A package substrate including a circuit board and a heat-dissipating element is provided. The circuit board has a through opening adapted for accommodating an electronic element. The heat-dissipating element is disposed at the circuit board and covers one side of the through opening. The heat-dissipating element includes a heat-dissipating plate, an adhesive layer and an antioxidation layer. The heat-dissipating plate has a first surface facing the through opening and a second surface opposite to the first surface. The adhesive layer is disposed on the first surface and the heat-dissipating plate adheres to the circuit board through the adhesive layer. The antioxidation layer is disposed on the second surface. An electronic assembly including the package substrate is also provided.

主权项

1. A package substrate, comprising:
a circuit board, having a through opening adapted for accommodating an electronic element; and a heat-dissipating element, disposed at the circuit board and covering one side of the through opening and only contacting a dielectric material of a dielectric layer of the circuit board, the heat-dissipating element comprising:
a heat-dissipating plate, having a first surface facing the through opening and a second surface opposite to the first surface;an adhesive layer, disposed on the first surface, wherein the heat-dissipating plate adheres to the dielectric material of the dielectric layer of the circuit board through the adhesive layer; andan antioxidation layer, disposed on the second surface.