Micro lead frame structure having reinforcing portions and method

摘要

In one embodiment, a micro lead frame structure includes one or more stiffness reinforcing structures formed on leads and/or connecting structures. The stiffness reinforcing structures can be formed by leaving predetermined portions of the micro lead frame at full thickness including, for example, portions of an inner lead, portions of an outer lead, and portions of a connecting bar, combinations thereof, and other structures. The stiffness reinforcing structures are configured to reduce deformation defects and electrical short defects caused by assembly processes.

主权项

1. An electronic packaged device, comprising:
a die pad having peripheral edge segments; a plurality of first leads segregated into at least two sets that extend along respective ones of at least two peripheral edge segments of the die pad in spaced relation thereto, wherein each first lead includes a first bond finger proximate to the die pad and a first support bar extending outward from a distal end of the first bond finger in a direction away from the die pad, and wherein the first support bar includes a recessed bottom surface; a plurality of second leads segregated into at least two sets that extend along the respective ones of at least two peripheral edge segments of the die pad in spaced relation thereto, wherein each second lead includes a second bond finger proximate to the die pad and a second support bar extending outward from a distal end of the second bond finger in a direction away from the die pad, and wherein the second support bar is shorter than the first support bar, and wherein the second support bar includes a stiffness reinforcing structure extending along a top surface of the second support bar that is configured to reduce movement of the second lead during assembly; an electronic die attached to the die pad and electrically connected to at least some of the first leads and the second leads; and a package body defining generally planar bottom and side surfaces, the package body at least partially encapsulating the first leads, the second leads and the electronic die such that at least portions of the first leads and at least portions of the second leads are exposed in the bottom and side surfaces of the package body.