发明名称 |
Contact and interconnect metallization for solar cells |
摘要 |
A fabrication line includes a texturizing module configured to texture a substrate, an emitter module configured to form an emitter region, a passivation layer module configured to form a passivation layer, a barrier contact module configured to form a barrier contact region, a firing module configured to anneal the barrier contact region, a top metal contact module configured to form a top metal contact region, and a soldering module configured to solder the barrier contact region to the top metal contact region. The modules are integrated by one or more automated substrate handlers into a single fabrication line. A method for fabricating a solar cell includes sequentially, in an automated fabrication line: doping a dopant in a substrate; disposing a passivation layer; disposing and annealing a barrier metal paste to form a barrier contact; and disposing and annealing a metal contact paste to form a top metal contact region. |
申请公布号 |
US9184333(B2) |
申请公布日期 |
2015.11.10 |
申请号 |
US201313791067 |
申请日期 |
2013.03.08 |
申请人 |
APPLIED MATERIALS, INC. |
发明人 |
Parikh Suketu Arun;Shu Jen;Gee James M. |
分类号 |
H01L31/0224;H01L31/18;H01L21/67;H01L31/0216;H01L31/068 |
主分类号 |
H01L31/0224 |
代理机构 |
Patterson & Sheridan, LLP |
代理人 |
Patterson & Sheridan, LLP |
主权项 |
1. A method for fabricating a solar cell comprising:
sequentially in an automated fabrication line:
doping a dopant in a substrate in a first processing module;disposing a passivation layer on the substrate in a second processing module;disposing a barrier metal paste on the substrate in a third processing module;annealing the barrier metal paste to form a barrier contact region in a fourth processing module;disposing a top metal contact paste on the barrier contact region in a fifth processing module; andannealing the top metal contact paste to form a top metal contact region in a sixth processing module,wherein the automated fabrication line comprises:
one or more automated substrate handlers that are positioned between each of the sequentially disposed processing modules to transfer the substrate therebetween; anda system controller that is adapted to control the transfer of the substrate between two or more of the sequentially disposed processing modules using the automated substrate handlers. |
地址 |
Santa Clara CA US |