发明名称 Contact and interconnect metallization for solar cells
摘要 A fabrication line includes a texturizing module configured to texture a substrate, an emitter module configured to form an emitter region, a passivation layer module configured to form a passivation layer, a barrier contact module configured to form a barrier contact region, a firing module configured to anneal the barrier contact region, a top metal contact module configured to form a top metal contact region, and a soldering module configured to solder the barrier contact region to the top metal contact region. The modules are integrated by one or more automated substrate handlers into a single fabrication line. A method for fabricating a solar cell includes sequentially, in an automated fabrication line: doping a dopant in a substrate; disposing a passivation layer; disposing and annealing a barrier metal paste to form a barrier contact; and disposing and annealing a metal contact paste to form a top metal contact region.
申请公布号 US9184333(B2) 申请公布日期 2015.11.10
申请号 US201313791067 申请日期 2013.03.08
申请人 APPLIED MATERIALS, INC. 发明人 Parikh Suketu Arun;Shu Jen;Gee James M.
分类号 H01L31/0224;H01L31/18;H01L21/67;H01L31/0216;H01L31/068 主分类号 H01L31/0224
代理机构 Patterson & Sheridan, LLP 代理人 Patterson & Sheridan, LLP
主权项 1. A method for fabricating a solar cell comprising: sequentially in an automated fabrication line: doping a dopant in a substrate in a first processing module;disposing a passivation layer on the substrate in a second processing module;disposing a barrier metal paste on the substrate in a third processing module;annealing the barrier metal paste to form a barrier contact region in a fourth processing module;disposing a top metal contact paste on the barrier contact region in a fifth processing module; andannealing the top metal contact paste to form a top metal contact region in a sixth processing module,wherein the automated fabrication line comprises: one or more automated substrate handlers that are positioned between each of the sequentially disposed processing modules to transfer the substrate therebetween; anda system controller that is adapted to control the transfer of the substrate between two or more of the sequentially disposed processing modules using the automated substrate handlers.
地址 Santa Clara CA US