发明名称 基板処理装置、基板処理方法および半導体装置の製造方法
摘要 <p>A substrate processing apparatus includes a processing chamber in which a substrate is processed, a substrate holder configured to be loaded into and unloaded from the processing chamber while holding the substrate, a transfer chamber in which a charging operation for causing the substrate holder to hold an unprocessed substrate and a discharging operation for taking out a processed substrate from the substrate holder are performed, and a cleaning unit configured to blow clean air into the transfer chamber. The transfer chamber has a polygonal plan-view shape and includes corner areas. The cleaning unit is arranged in one of the corner areas of the transfer chamber.</p>
申请公布号 JP5806811(B2) 申请公布日期 2015.11.10
申请号 JP20100223418 申请日期 2010.10.01
申请人 发明人
分类号 H01L21/31;C23C16/44;H01L21/22;H01L21/324;H01L21/677;H01L21/683 主分类号 H01L21/31
代理机构 代理人
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