发明名称 Diffusion barrier coated substrates and methods of making the same
摘要 Devices on a diffusion barrier coated metal substrates, and methods of making the same are disclosed. The devices include a metal substrate, a diffusion barrier layer on the metal substrate, one or more insulator layers on the diffusion barrier layer, and an antenna and/or inductor on the one or more insulator layer(s). The method includes forming a diffusion barrier layer on the metal substrate, forming one or more insulator layers on the diffusion barrier layer; and forming an antenna and/or inductor on an uppermost one of the insulator layer(s). The antenna and/or inductor is electrically connected to at least one of the diffusion barrier layer and/or the metal substrate. Such diffusion barrier coated substrates prevent diffusion of metal atoms from the metal substrate into device layers formed thereon.
申请公布号 US9183973(B2) 申请公布日期 2015.11.10
申请号 US201313873156 申请日期 2013.04.29
申请人 Thin Film Electronics ASA 发明人 Kamath Arvind;Kocsis Michael;McCarthy Kevin;Wong Gloria;Li Jiang
分类号 H01F5/00;H01Q7/00;H01L29/786;H01L27/12;H01Q1/22;H01F41/04 主分类号 H01F5/00
代理机构 Central California IP Group, P.C. 代理人 Fortney Andrew D.;Central California IP Group, P.C.
主权项 1. A device, comprising: a) a metal substrate, including a foil or sheet of aluminum, copper, titanium, stainless steel or molybdenum, and one or more outermost conductive diffusion barrier layers thereon, b) one or more insulator layers on said one or more outermost conductive diffusion barrier layers, and c) an antenna and/or inductor on the one or more insulator layers, wherein said antenna and/or inductor is in electric contact with the one or more outermost conductive diffusion barrier layers.
地址 Oslo NO