发明名称 Betavoltaic power converter die stacking
摘要 A power converter comprises a first die and a second die. Each die comprises a semiconductor substrate comprising a junction for converting nuclear radiation particles to electrical energy, the junction of each semiconductor substrate comprising a first side and a second side, a first electrode comprising a nuclear radiation-emitting radioisotope deposited on the semiconductor substrate, the first electrode being electrically connected to the first side of the junction, and a second electrode deposited on the semiconductor substrate, the second electrode being electrically connected to the second side. A bond is formed between one of the first electrode or the second electrode of the first die and one of the first electrode or the second electrode of the second die, wherein the bond forms an electrical contact between the bonded electrodes.
申请公布号 US9183960(B2) 申请公布日期 2015.11.10
申请号 US201012790334 申请日期 2010.05.28
申请人 Medtronic, Inc. 发明人 Batchelder Geoffrey D.
分类号 H01L31/115;H01L21/00;G21H1/00;G21H1/06;H01L27/146 主分类号 H01L31/115
代理机构 代理人 Mburu Evans M.
主权项 1. A power converter comprising: a first die comprising: a semiconductor substrate comprising a junction for converting nuclear radiation particles to electrical energy, the junction comprising a first side and a second side;a first electrode comprising a nuclear radiation-emitting radioisotope deposited on the semiconductor substrate, the first electrode being electrically connected to the first side of the junction; anda second electrode deposited on the semiconductor substrate, the second electrode being electrically connected to the second side of the junction; a second die comprising: a semiconductor substrate comprising a junction for converting nuclear radiation particles to electrical energy, the junction of the second die comprising a first side and a second side;a first electrode comprising a nuclear radiation-emitting radioisotope deposited on the semiconductor substrate of the second die, the first electrode of the second die being electrically connected to the first side of the junction of the second die; anda second electrode deposited on the semiconductor substrate of the second die, the second electrode being electrically connected to the second side of the junction of the second die; and a bond between one of the first electrode or the second electrode of the first die and one of the first electrode or the second electrode of the second die, wherein the bond forms an electrical contact between the bonded electrodes.
地址 Minneapolis MN US