Systems and methods for handling wafers

摘要

A system for handling wafers comprising: at least one unload station; at least one intermediate station designed to hold the wafers at an angle; a processing station; and a transfer device configured to move the wafers between the stations. The intermediate station may be configured to receive the wafers in a back-to-back arrangement. An apparatus for handling wafers comprising: on one side, a vacuum gripper configured to grip individual wafers; and, on the other side, a gravity gripper configured to support one or more wafers when positioned beneath the wafers and lifted. A method for handling wafers, comprising: unloading wafers; transferring the wafers to an intermediate station; transferring the wafers from the intermediate station to a processing station; treating the wafers; unloading the wafers from the processing station; and reloading the wafers in a carrier, wherein the wafers are unloaded, transferred and reloaded by a transfer device.

主权项

1. A system for handling a plurality of wafers, the wafers having a generally planar upper surface and a generally planar lower surface, the system comprising:
at least one load/unload station; at least one intermediate station having a front loading end and a back stop end, the at least one intermediate station configured to hold the wafers with a plane of the wafers positioned at an angle to a horizontal plane and wherein the angle is between 30 and 60 degrees downwardly from the front loading end to the back stop end, wherein the at least one intermediate station has at least one slot configured to receive a first one of the plurality of wafers and a second one of the plurality of wafers in a back-to-back arrangement wherein the first wafer is inserted into the at least one slot, and the second wafer is inserted into the at least one slot adjacent to the first wafer with the adjacent surfaces of the first and second wafers in contact, the at least one intermediate station further comprising a wafer separation mechanism configured to separate the first and second wafers from the back-to-back arrangement, wherein the wafer separation mechanism comprises a vacuum element configured to lift the second wafer in the back-to-back arrangement; and a transfer device configured to transport the wafers between the load/unload station and the intermediate station.