| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide: copper foil for a printed wiring board, which can form a circuit pattern at a favorable fine pitch; a laminated body using the copper foil; and a printed wiring board. <P>SOLUTION: In the copper foil for the printed wiring board, there are formed a copper foil base material and a layer to be coated which is formed on the copper foil base material and formed of a single metal or an alloy, an aqueous ferric chloride whose specific gravity is 40 degrees at Baume and having 3.2 mol/L is used as a corrosive liquid, an Ag/AgCI electrode is used in the corrosive liquid at a liquid temperature of 50°C without stirring the corrosive liquid, and natural potential at the start of measurement is higher than the natural potential of the copper foil base material when measured in a measurement range of 1 cm×1 cm from the side of the layer to be coated, and is lowered to the same potential as the potential of the copper foil base material within 240 seconds from the start of the measurement. <P>COPYRIGHT: (C)2012,JPO&INPIT</p> |
