发明名称 |
ELECTROLESS DEPOSITION OF CONTINUOUS PLATINUM LAYER USING COMPLEX Co2+ METAL ION REDUCER |
摘要 |
PROBLEM TO BE SOLVED: To provide a solution for electroless deposition of platinum.SOLUTION: A solution for electroless deposition of platinum comprises: a Co2+ concentrated stock solution source 208 containing a Co2+ concentrated stock solution; a Pt4+ concentrated stock solution source 212 containing a Pt4+ concentrated stock solution; and a deionized water source 216 containing deionized water. A mixed electrolyte solution 232 of the Co2+ concentration stock solution and the Pt4+ concentration stock solution is formed a flow 220 from the Co2+ concentrated stock solution source 208 joined by a flow 224 from the Pt4+ concentrated stock solution source 212 and a flow 228 from the deionized water source 216. A method for performing electroless plating of platinum includes exposing a wafer 236 to the mixed electrolyte solution 232. |
申请公布号 |
JP2015196904(A) |
申请公布日期 |
2015.11.09 |
申请号 |
JP20150074711 |
申请日期 |
2015.04.01 |
申请人 |
LAM RESEARCH CORPORATION |
发明人 |
EUGENIJUS NORKUS;INA STANKEVICIENE;ALDONA JAGMINIENE;LORETA TAMASAUSKAITE-TAMASIUNAITE;ANIRUDDHA JOI;YEZDI DORDI |
分类号 |
C23C18/44 |
主分类号 |
C23C18/44 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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