| 摘要 |
PROBLEM TO BE SOLVED: To provide a glass interposer 1 improved in a heat dissipation effect in order to solve such a problem that a glass interposer is deteriorated in thermal conductivity while a base material itself is an insulation layer material and an interposer excellent in electrical characteristics is expected.SOLUTION: A glass interposer 1 includes a glass base material 4 including a plurality of through electrodes 5 provided therein and a plurality of insulation layers 2 and wiring layers 3 laminated on an upper part 6 and a lower part 7 of the glass base material 4. A through electrode diameter of the through electrodes 5 on a chip connection side is made larger than a through electrode diameter on a substrate connection side. |
