| 摘要 |
PROBLEM TO BE SOLVED: To provide a polishing composition enabling surface defects with specific size existing on a surface of a polishing object such as a semiconductor substrate to be selectively reduced.SOLUTION: There is provided the polishing composition which contains hydroxyethyl cellulose, water and abrasive grain, and in which molecular weight of the hydroxyethyl cellulose is 500,000 to 1,500,000 and ratio of mass% of the hydroxyethyl cellulose to mass% of the abrasive grain is 0.0075 to 0.025. |
