发明名称 ELECTRODE FOR ELECTROLYTIC PLATING AND ELECTROLYTIC PLATING APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide an electrode for plating which is used in a plating method and enables improvement of reliability, quality and stability of a metal composite of a core-shell structure, and an electrolytic plating apparatus containing it.SOLUTION: An electrode for electrolytic plating includes a non-conductive pattern formed partially on the surface of a conductive material and plates the surface of a to-be-plated object by bringing the exposed surface of the conductive material not formed with the non-conductive pattern into contact with the to-be-plated object, and, preferably, the plurality of to-be-plated objects do not come in simultaneous contact with the exposed surface of the conductive material not formed with the non-conductive pattern.
申请公布号 JP2015196905(A) 申请公布日期 2015.11.09
申请号 JP20150076031 申请日期 2015.04.02
申请人 OCI CO LTD 发明人 KANG SUNG-KOO;KIM KI-HOON;OH MIN-KYUNG;KIM HYUNG-RAK
分类号 C25D17/12;C25D17/22 主分类号 C25D17/12
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