发明名称 UNIT FOR PREHEATING A PRINTED CIRCUIT BOARD AND APPARATUS FOR BONDING A DIE INCLUDING THE SAME
摘要 A substrate preheating unit includes a support plate, a preheating plate, and a plurality of support blocks. The support plate supports the substrate loaded on the upper side thereof. The preheating plate is combined with the lower side of the support plate and includes at least one heater for preheating the substrate inside. The support blocks support the lower side of the preheating plate against the different structures to prevent heat from the preheating plate from being directly conducted to the different structure which is heat-sensitive.
申请公布号 KR20150124614(A) 申请公布日期 2015.11.06
申请号 KR20140051312 申请日期 2014.04.29
申请人 SEMES CO., LTD. 发明人 LEE, WON BAE;LIM, SOK TAEK
分类号 H05K3/22;H05B1/00 主分类号 H05K3/22
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