Method for Producing a Switching Module and an Associated Grid Module, and an Associated Grid Module and Corresponding Electronic Subassembly

摘要

A method for producing a switching module that comprises at least one electronic component and at least one cooling element configured to cool the at least one electronic component is disclosed. The method comprises coupling the at least one electronic component with the at least one cooling element, inserting the at least one electronic component and the at least one cooling element into an injection mold, positioning a spring element between the at least one electronic component and an inner side of the injection mold, the spring element being supported on the inner side of the injection mold such that the at least one cooling element is pressed against a wall of the injection mold, and at least partially encapsulating the at least one electronic component and the at least one cooling element with a plastic.

主权项

1. A method for producing a switching module that comprises at least one electronic component and at least one cooling element configured to cool the at least one electronic component, the method comprising:
coupling the at least one electronic component with the at least one cooling element; inserting the at least one electronic component and the at least one cooling element into an injection mold; positioning a spring element between the at least one electronic component and an inner side of the injection mold, the spring element being supported on the inner side of the injection mold such that the at least one cooling element is pressed against a wall of the injection mold; and at least partially encapsulating the at least one electronic component and the at least one cooling element with a plastic.