发明名称 INJECTION MOLDING METHOD FOR RESIN COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide an injection molding die and a resin molding method which make it possible to stably mold an inexpensive molded object whose silver streak is suppressed and weldline is eliminated.SOLUTION: A method for subjecting a resin composition to injection molding uses an injection molding die 1 including a mold cavity 4 for molding, a runner that introduces the resin composition loaded from a sprue 5 into the mold cavity 4, and a gate that connects the mold cavity and the runner. Shear heating of the gate part is 30°C or below. A predetermined polycarbonate resin composition is used as the resin composition.
申请公布号 JP2015193189(A) 申请公布日期 2015.11.05
申请号 JP20140073238 申请日期 2014.03.31
申请人 MITSUBISHI CHEMICALS CORP 发明人 MAEDA MITSUAKI;HAYAMIZU HIROKI;KONDO ATSUSHI
分类号 B29C45/00;B29C45/27 主分类号 B29C45/00
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