SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OR THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor device which has a PoP structure and inhibits warpage of a package.SOLUTION: A semiconductor device comprises: a semiconductor chip 10 flip-chip mounted on one surface 32 of a wiring board 30; a semiconductor chip 20 flip-chip mounted on the other surface 33 of the wiring board 30; an encapsulation resin 71 which covers the semiconductor chip 10; an encapsulation resin 72 which covers the semiconductor chip 20; a plurality of conductor posts provided to pierce the encapsulation resin 72; and a plurality of solder balls mounted on another ends of the plurality of conductor posts exposed from the encapsulation resin 72. Mounting directions of the semiconductor directions are different from each other by 90°. Both planar shapes of the semiconductor chips 10, 20 are rectangular shapes, and the semiconductor chi 10 is mounted to make a long side be parallel with a long side of the wiring board 30 and the semiconductor chi p20 is mounted to make a long side be perpendicular to the long side of the wiring board 30.