发明名称 Method of Preparing and Using Photosensitive Material
摘要 Provided in one embodiment is a method that includes selecting a photoresist that is one of a positive-tone photoresist and a negative-tone photoresist. A first additive or a second additive is selected based on the photoresist. The first additive has a fluorine component and a base component attached to a polymer and is selected if the a positive-tone resist is provided. The second additive has the fluorine component and an acid component attached to the polymer and is selected with a negative-tone resist is provided. The selected photoresist and the selected additive material are applied to a target substrate.
申请公布号 US2015316846(A1) 申请公布日期 2015.11.05
申请号 US201414310656 申请日期 2014.06.20
申请人 Taiwan Semiconductor Manufacturing Company, Ltd. 发明人 Zi An-Ren;Wu Chen-Hau;Chang Ching-Yu
分类号 G03F7/039;G03F7/30 主分类号 G03F7/039
代理机构 代理人
主权项 1. A method of semiconductor device fabrication, comprising: providing a photoresist, wherein the photoresist is one of a positive-tone photoresist and a negative-tone photoresist; selecting an additive material, wherein the additive material is one of a first additive and a second additive, wherein the first additive has a fluorine component and a base component attached to a polymer; wherein the second additive has the fluorine component and an acid component attached to the polymer, wherein the selecting the additive includes: selecting the first additive if the providing the photoresist included providing the positive-tone resist and selecting the second additive if the providing the photoresist included selecting the negative-tone resist; and applying the provided photoresist and the selected additive material to a target substrate.
地址 Hsin-Chu TW