发明名称 |
Method of Preparing and Using Photosensitive Material |
摘要 |
Provided in one embodiment is a method that includes selecting a photoresist that is one of a positive-tone photoresist and a negative-tone photoresist. A first additive or a second additive is selected based on the photoresist. The first additive has a fluorine component and a base component attached to a polymer and is selected if the a positive-tone resist is provided. The second additive has the fluorine component and an acid component attached to the polymer and is selected with a negative-tone resist is provided. The selected photoresist and the selected additive material are applied to a target substrate. |
申请公布号 |
US2015316846(A1) |
申请公布日期 |
2015.11.05 |
申请号 |
US201414310656 |
申请日期 |
2014.06.20 |
申请人 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
发明人 |
Zi An-Ren;Wu Chen-Hau;Chang Ching-Yu |
分类号 |
G03F7/039;G03F7/30 |
主分类号 |
G03F7/039 |
代理机构 |
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代理人 |
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主权项 |
1. A method of semiconductor device fabrication, comprising:
providing a photoresist, wherein the photoresist is one of a positive-tone photoresist and a negative-tone photoresist; selecting an additive material, wherein the additive material is one of a first additive and a second additive, wherein the first additive has a fluorine component and a base component attached to a polymer; wherein the second additive has the fluorine component and an acid component attached to the polymer, wherein the selecting the additive includes:
selecting the first additive if the providing the photoresist included providing the positive-tone resist and selecting the second additive if the providing the photoresist included selecting the negative-tone resist; and applying the provided photoresist and the selected additive material to a target substrate. |
地址 |
Hsin-Chu TW |