发明名称 COPPER NANOPARTICLE DISPERSION AND METHOD FOR MANUFACTURING ELECTROCONDUCTIVE SUBSTRATE
摘要 Provided is a method for manufacturing an electroconductive substrate with which it is possible to obtain an electroconductive substrate that has exceptional electroconductivity due to being sintered at a low temperature or for a short period of time. The present invention is a method for manufacturing an electroconductive substrate, which has: a step for forming a coating film by coating a base material with a copper nanoparticle dispersion that contains copper nanoparticles, a carboxylic acid, an alkylamine, a polymer dispersing agent, and a solvent; and a step for sintering the coating film. The polymer dispersing agent has one of either an amine value or an acid value of 30-160 mgKOH/g and the other of either the amine value or the acid value at 0-160 mgKOH/g, and the volume-average particle diameter is 500 nm or less as obtained by dynamic light scattering.
申请公布号 WO2015166755(A1) 申请公布日期 2015.11.05
申请号 WO2015JP60007 申请日期 2015.03.30
申请人 DAI NIPPON PRINTING CO., LTD. 发明人 OMORI, YOSHINOBU;TAGUCHI, YOSUKE;SAWADA, MASANORI;HOJO, MIKIKO
分类号 H01B13/00;B22F1/00;B22F9/00;H01B1/02;H01B1/22;H05K3/00 主分类号 H01B13/00
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