发明名称 |
COPPER NANOPARTICLE DISPERSION AND METHOD FOR MANUFACTURING ELECTROCONDUCTIVE SUBSTRATE |
摘要 |
Provided is a method for manufacturing an electroconductive substrate with which it is possible to obtain an electroconductive substrate that has exceptional electroconductivity due to being sintered at a low temperature or for a short period of time. The present invention is a method for manufacturing an electroconductive substrate, which has: a step for forming a coating film by coating a base material with a copper nanoparticle dispersion that contains copper nanoparticles, a carboxylic acid, an alkylamine, a polymer dispersing agent, and a solvent; and a step for sintering the coating film. The polymer dispersing agent has one of either an amine value or an acid value of 30-160 mgKOH/g and the other of either the amine value or the acid value at 0-160 mgKOH/g, and the volume-average particle diameter is 500 nm or less as obtained by dynamic light scattering. |
申请公布号 |
WO2015166755(A1) |
申请公布日期 |
2015.11.05 |
申请号 |
WO2015JP60007 |
申请日期 |
2015.03.30 |
申请人 |
DAI NIPPON PRINTING CO., LTD. |
发明人 |
OMORI, YOSHINOBU;TAGUCHI, YOSUKE;SAWADA, MASANORI;HOJO, MIKIKO |
分类号 |
H01B13/00;B22F1/00;B22F9/00;H01B1/02;H01B1/22;H05K3/00 |
主分类号 |
H01B13/00 |
代理机构 |
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代理人 |
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地址 |
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