| 发明名称 |
LIQUID COOLING MEDIUM FOR ELECTRONIC DEVICE COOLING |
| 摘要 |
Liquid cooling mediums employed to immersion-cool electronic hardware devices. Such liquid cooling mediums have a flash point of at least 190° C., as determined according to ASTM D92, and a viscosity of 27 centistokes (“cSt”) or less at 40° C., as determined according to ASTM D445. Such liquid cooling mediums can be employed to immersion-cool such devices as computer servers, server motherboards, and microprocessors. |
| 申请公布号 |
US2015319889(A1) |
申请公布日期 |
2015.11.05 |
| 申请号 |
US201314648015 |
申请日期 |
2013.12.17 |
| 申请人 |
Dow Global Technologies LLC |
发明人 |
Flory Anny L.;Esseghir Mohamed |
| 分类号 |
H05K7/20 |
主分类号 |
H05K7/20 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An apparatus comprising:
(a) an electronic hardware device; and (b) a liquid cooling medium,wherein said electronic hardware device is at least partially submerged in said liquid cooling medium,wherein said liquid cooling medium has a flash point of at least 190° C., as determined according to ASTM D92,wherein said liquid cooling medium has a viscosity of 27 centistokes (“cSt”) or less at 40° C., as determined according to ASTM D445. |
| 地址 |
Midland MI US |
