| 摘要 |
PROBLEM TO BE SOLVED: To provide a technology capable of efficiently preventing infiltration at a circuit edge part further during soft etching of a copper foil circuit without reducing joint force between a copper foil and a resin substrate even under condition where treatments conducted in a manufacturing process of a printed circuit become higher temperature with further proceeding down sizing and high integration of a semiconductor device while developments of electronic equipment progress and there is heat generation during use of devices after made as product.SOLUTION: There is provided a copper foil for printed circuit having a roughened treatment layer by a copper-cobalt-nickel alloy plating on a surface of a copper foil, a cobalt-nickel alloy plating layer formed on the roughened treatment layer, and a zinc-nickel alloy plating layer on the cobalt-nickel alloy plating, where the total amount of the zinc-nickel alloy plating is 150 to 500 μg/dm, a lower limit of a nickel ratio in the alloy layer is 0.16, an upper limit is 0.40, and the nickel content is 50 μg/dm. |
