发明名称 |
HEAT DISSIPATION SHEET, MANUFACTURING METHOD OF HEAT DISSIPATION SHEET, SLURRY FOR HEAT DISSIPATION SHEET AND POWER DEVICE |
摘要 |
PROBLEM TO BE SOLVED: To provide a heat dissipation sheet capable of achieving high thermal conductivity and high withstand voltage while ensuring the reliability at a high temperature of a power device.SOLUTION: The heat dissipation sheet includes: boron nitride secondary particles which include a resin A and a matrix resin B, in which the resin A and the resin B are resins different from each other, and the Tg of the resin B is 150°C or more. |
申请公布号 |
JP2015195292(A) |
申请公布日期 |
2015.11.05 |
申请号 |
JP20140072859 |
申请日期 |
2014.03.31 |
申请人 |
MITSUBISHI CHEMICALS CORP |
发明人 |
SAWAMURA TOSHIYUKI;ISOJIMA TAKESHI;SUZUKI TAKUYA;YAMAZAKI MASANORI |
分类号 |
H01L23/373;H01L23/36;H05K7/20 |
主分类号 |
H01L23/373 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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