发明名称 HEAT DISSIPATION SHEET, MANUFACTURING METHOD OF HEAT DISSIPATION SHEET, SLURRY FOR HEAT DISSIPATION SHEET AND POWER DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a heat dissipation sheet capable of achieving high thermal conductivity and high withstand voltage while ensuring the reliability at a high temperature of a power device.SOLUTION: The heat dissipation sheet includes: boron nitride secondary particles which include a resin A and a matrix resin B, in which the resin A and the resin B are resins different from each other, and the Tg of the resin B is 150°C or more.
申请公布号 JP2015195292(A) 申请公布日期 2015.11.05
申请号 JP20140072859 申请日期 2014.03.31
申请人 MITSUBISHI CHEMICALS CORP 发明人 SAWAMURA TOSHIYUKI;ISOJIMA TAKESHI;SUZUKI TAKUYA;YAMAZAKI MASANORI
分类号 H01L23/373;H01L23/36;H05K7/20 主分类号 H01L23/373
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