| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a thermosetting resin composition excellent in heat-yellowing resistance, light resistance, gas barrier properties and adhesiveness, which can form a transparent cured product, in optical semiconductor applications. <P>SOLUTION: This thermosetting resin composition contains a cyclic organopolysiloxane expressed by formula (1), wherein R<SP POS="POST">1</SP>represents a substituted or non-substituted 1-10C alkyl, 3-10C cycloalkyl, aryl or aralkyl group; R<SP POS="POST">2</SP>represents an acryloxy or methacryloxy group; X represents a 3-10C bivalent hydrocarbon group; a is an integer of 1 or more; b is an integer of 0 or more; a+b is an integer of 3-20. <P>COPYRIGHT: (C)2013,JPO&INPIT |
