INDIRECT CONTACT PROBING SYSTEM AND PROBING METHOD USING THE SAME

摘要

The present invention relates to an indirect contact probing system and a probing method using the same, capable of reducing costs necessary for test equipment while stably and rapidly testing the characteristics of semiconductor elements such as memory elements, integrated circuits, and through-electrodes configured on a wafer or a PCB. The system comprises: a dielectric contactor which comes in electric contact with contact terminals of through-electrodes or semiconductor elements configured on a wafer or a PCB; a probe which receives electric characteristic values input through the dielectric contactor; and a probing unit which removes a capacitor coupling value of the dielectric contactor from the electric characteristic values input through the probe, to measure and test the unique electric characteristics of the through-electrodes or the semiconductor elements.