| 摘要 |
An integrated infrared sensor device 1 comprises a sensor substrate 2 and a filter substrate 7. The sensor substrate 2 has a back surface 3 which has a cavity 5 defined therein and an opposing front surface 4 which has at least one infrared sensing element 6 formed therein or arranged thereon. The filter substrate 7 is arranged on the back surface 3 of the sensor substrate 2 such that the filter substrate 7 at least partially covers the cavity 5. The filter substrate 7 is furthermore adapted in shape and composition to transmit infrared radiation and to attenuate radiation in at least part of the visible light spectrum. The device 1 may comprise at least one solder bump 8 arranged on the front surface 4 of the sensor substrate 2 for connecting the device 1 to a carrier 12 in a flip-chip arrangement. The device may comprise a cap 11 arranged on the front surface 4 for blocking out stray radiation. The device may comprise a coating (9, Fig. 2) applied to the filter substrate 7 for collimating a field of view 10 of the infrared sensing element 6. |
