| 发明名称 | Light emitting device and light emitting device package | ||
| 摘要 | According to example embodiments, a light emitting device package includes a package body including nanofibers and light-reflective particles dispersed in a resin, first and second electrodes in the package body, and a light emitting device on the package body. The emitting device is electrically connected to the first and second electrodes. | ||
| 申请公布号 | US9178124(B2) | 申请公布日期 | 2015.11.03 |
| 申请号 | US201414149117 | 申请日期 | 2014.01.07 |
| 申请人 | Samsung Electronics Co., Ltd. | 发明人 | Kim Jung Hoon |
| 分类号 | H01L33/00;H01L33/60;H01L23/00;H01L33/50;H01L33/56 | 主分类号 | H01L33/00 |
| 代理机构 | Harness, Dickey & Pierce, P.L.C. | 代理人 | Harness, Dickey & Pierce, P.L.C. |
| 主权项 | 1. A light emitting device package comprising: a package body including nanofibers and light-reflective particles dispersed in a resin; first and second electrodes in the package body; and a light emitting device on the package body, the light emitting device being electrically connected to the first and second electrodes. | ||
| 地址 | Gyeonggi-Do KR | ||