发明名称 Pattern forming method
摘要 According to one embodiment, a pattern forming method includes forming, on an underlying region, a neutral film having an affinity for first and second polymers, forming a first pinning part having an affinity for the first polymer by irradiating a first region of the neutral film with an energy beam, forming, on the neutral film including the first pinning part, a block copolymer film containing the first and second polymers, and performing a predetermined treatment for the block copolymer film to perform a microphase separation.
申请公布号 US9177825(B2) 申请公布日期 2015.11.03
申请号 US201414467213 申请日期 2014.08.25
申请人 KABUSHIKI KAISHA TOSHIBA 发明人 Seino Yuriko
分类号 H01L21/311;H01L21/027;H01L21/02 主分类号 H01L21/311
代理机构 Finnegan, Henderson, Farabow, Garrett & Dunner, LLP 代理人 Finnegan, Henderson, Farabow, Garrett & Dunner, LLP
主权项 1. A pattern forming method comprising: forming, on an underlying region, a neutral film having an affinity for first and second polymers; forming a first pinning part having an affinity for the first polymer by irradiating a first region of the neutral film with an energy beam; forming, on the neutral film including the first pinning part, a block copolymer film containing the first and second polymers; forming, on the first pinning part, a pattern including first and second portions formed of the first polymer and a third portion provided between the first and second portions and formed of the second polymer, by performing a predetermined treatment for the block copolymer film to perform a microphase separation; and removing the first and second portions or removing the third portion, wherein forming the neutral film includes: forming a preliminary neutral film; andthinning a portion of the preliminary neutral film, which is formed in the first region.
地址 Tokyo JP