| 发明名称 | MN doped SN-base solder alloy and solder joints thereof with superior drop shock reliability | ||
| 摘要 | A Sn—Ag—Cu-based lead-free solder alloy and solder joints thereof with superior drop shock reliability are disclosed. The solder contains between greater than 0 wt. % and less than or equal to about 1.5 wt. % Ag; between greater than or equal to about 0.7 wt. % and less than or equal to about 2.0 wt. % Cu; between greater than or equal to about 0.001 and less than or equal to about 0,2 wt. % Mn; and a remainder of Sn. | ||
| 申请公布号 | US9175368(B2) | 申请公布日期 | 2015.11.03 |
| 申请号 | US201213542586 | 申请日期 | 2012.07.05 |
| 申请人 | Indium Corporation | 发明人 | Liu Weiping;Lee Ning-Cheng |
| 分类号 | B23K35/26;C22C13/00;C22C13/02;B23K35/02 | 主分类号 | B23K35/26 |
| 代理机构 | Sheppard Mullin Richter & Hampton LLP | 代理人 | Sheppard Mullin Richter & Hampton LLP |
| 主权项 | 1. A solder, consisting of: between 0.3 wt. % and 0.7 wt. % Ag; between 0.7 wt. % and 1.5 wt. % Cu; between 0.001 wt. % and 0.09 wt. % Mn; and a remainder of Sn. | ||
| 地址 | Clinton NY US | ||