发明名称 |
CHIP ELECTRONIC COMPONENT, MANUFACTURING METHOD THEREOF AND BOARD HAVING THE SAME MOUNTED THEREON |
摘要 |
The present invention provides a chip electronic component which includes a magnetic body which includes an insulation substrate and a coil conductive pattern which is formed on at least one side of the insulation substrate, and an external electrode which is formed on both ends of the magnetic body to be connected to the end of the coil conductive pattern. The coil conductive pattern includes at least one groove. |
申请公布号 |
KR101565700(B1) |
申请公布日期 |
2015.11.03 |
申请号 |
KR20140077161 |
申请日期 |
2014.06.24 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
YOON, CHAN;LEE, DONG HWAN;HAN, JIN WOO |
分类号 |
H01F17/04;H01F27/28;H01F41/04;H05K1/18 |
主分类号 |
H01F17/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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