| 摘要 |
<p>A METHOD OF INSULATING A MICROMECHANICAL WAFER (10) WITH A DIELECTRIC LAYER (23) OVER SAID MICROMECHANICAL WAFER (10) USING A SPINNING TECHNIQUE. THE DIELECTRIC LAYER (23) IS THEN HEATED TO REMOVE WATER AND CURED THE LAYER OF THE MICROMECHANICAL DEVICE (10) TO PROVIDE A PROTECTIVE COATING TO THE MICROMECHANICAL DEVICE. MOST ILLUSTRATIVE DIAGRAM:</p> |
