STRUCTURE FOR ASSEMBLING FRAMES AND ELECTRONIC DEVICE THEROF

摘要

According to various embodiments of the present invention, a frame combining structure includes: a first frame; a second frame which is combined to the first frame; a protrusion accommodation groove which is formed in the first frame; a protrusion which is protruded in the second frame to be accommodated in the protrusion accommodation groove; and at least one contact protrusion which is protruded on at least one plane of the protrusion. The frame combining structure is provided so that the contact protrusion contacts an inner surface of the protrusion accommodation groove when the protrusion is accommodated in the protrusion accommodation groove. The present invention can prevent generation of noise or dust even though external force (for example, twisting and the like) is applied to a device, and also can assure reliability of the device by preventing degradation of fastening force due to insufficient mounting occurred during post-processing of a frame, by the frame combining structure which minimizes a contact plane between the protrusion and the protrusion accommodation groove.