HEAT TREATMENT APPARATUS FOR SUBSTRATE

摘要

The present invention relates to a heat treatment apparatus for a substrate, characterized by comprising a chamber part having a multiple walls connected to at least one among an upper wall and a lower wall to provide a heat treatment space for a substrate; a substrate support part storing the substrate in the chamber part; a heat radiation part installed in the heat treatment space, and thermally treating the substrate; and an opened and closed part opened and closed on the chamber part to allow the substrate to pass. Therefore, the heat treatment apparatus in the present invention provides a heat treatment space with an assembly-type wall by having multiple unit walls connected to the upper wall or lower wall of the chamber part, thereby enabling easy maintenance work for the heat radiation part and the substrate support part installed inside the heat treatment space.