Electronic component module and method of manufacturing the electronic component module

摘要

An electronic component module includes a circuit substrate including surface mount components mounted thereon, a resin layer embedding the surface mount components, and a conductor layer provided on a surface of the resin layer, wherein a conductive post is provided on the surface mount component, and an external electrode having a ground potential provided on the surface mount component is conductively connected to the conductor layer through the conductive post, whereby the conductor layer defines a shielding layer.