发明名称 Printed circuit board assembly and solder validation method
摘要 A solder validation method for a printed circuit board (PCB) having a pin hole extending through the PCB, an electrically conductive trace on a surface of the PCB, and an electrically conductive pin inserted through the pin hole includes the following. An electrically non-conductive portion is provided on the surface of the PCB between the pin hole and the trace such that the non-conductive portion electrically isolates the pin from the trace. After a soldering process intended to solder the pin and the trace together, a soldered connection between the pin and the trace is detected as being absent when no electrical continuity is between the pin and the trace as a soldered connection between the pin and the trace has to be present to provide the electrical continuity due to the pin and the trace otherwise being electrically isolated from one another by the non-conductive portion.
申请公布号 US9179536(B2) 申请公布日期 2015.11.03
申请号 US201313766237 申请日期 2013.02.13
申请人 Lear Corporation 发明人 Gawron Steven F.;Dahlstrom Jonathan
分类号 H05K3/00;H05K1/02;H05K1/18;H05K3/06 主分类号 H05K3/00
代理机构 Brooks Kushman P.C. 代理人 Brooks Kushman P.C.
主权项 1. A method for a printed circuit board (PCB) having a pin hole extending through the PCB, the method comprising: providing an electrically non-conductive ring entirely around the pin hole, the non-conductive ring being a portion of the PCB; providing an electrically conductive trace, lacking a solder coating thereon, on a surface of the PCB, the trace having a trace ring entirely around the non-conductive ring with the non-conductive ring being between the pin hole and the trace ring such that the non-conductive ring electrically isolates the pin hole from the trace ring; inserting an electrically conductive pin, having a rectangular cross-section, through the pin hole with corners of the pin physically intersecting corresponding portions of the non-conductive ring immediately adjacent to the pin hole, the pin and the trace ring being electrically isolated from one another by the non-conductive portion; after the pin is inserted through the pin hole, performing a soldering process intended to provide a soldered connection between the pin and the trace ring, wherein a soldered connection between the pin and the trace ring is present when the soldering process is successful, wherein a soldered connection between the pin and the trace ring is absent when the soldering process is unsuccessful; and detecting after the step of performing the soldering process intended to provide a soldered connection between the pin and the trace ring that a soldered connection between the pin and the trace ring is absent when electrical continuity is absent between the pin and the trace ring as a soldered connection between the pin and the trace ring has to be present to provide the electrical continuity between the pin and the trace ring due to the pin and the trace ring otherwise being physically separated and electrically isolated from one another by the non-conductive portion.
地址 Southfield MI US