发明名称 FLEXIBLE ELECTRONIC SYSTEM INCLUDING WIRE BOND
摘要 PROBLEM TO BE SOLVED: To provide a flexible device which allows for cost reduction by interconnecting rigid circuit segments or components.SOLUTION: A device includes a first rigid circuit, and a second rigid circuit including a plurality of second bond pads close to the first edge of the second rigid circuit. The second rigid circuit is adjacent to the first rigid circuit, has a first edge facing the first edge of the first rigid circuit, and has a plurality of first wires that are wire bonded. The plurality of first wires that are wire bonded, respectively, so that the first rigid circuit rotates freely for the second rigid circuit around the axis of rotation substantially parallel with the first edge, are connected electrically and mechanically with each of a plurality of first bond pads, and each of a plurality of second bond pads.
申请公布号 JP2015192146(A) 申请公布日期 2015.11.02
申请号 JP20150029117 申请日期 2015.02.18
申请人 INTEL CORP 发明人 ALEKSANDAR ALEKSOV;MAURO KOBRINSKY;JOHANNA SWAN;RAJENDRA C DIAS
分类号 H01L25/04;H01L21/60;H01L23/52;H01L25/18 主分类号 H01L25/04
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