THERMOSETTING RESIN COMPOSITION

摘要

PROBLEM TO BE SOLVED: To provide a thermosetting resin composition which is preferably usable in sealing materials for semiconductor devices, does not cause warp or cracks and has high reliability even used in a power device.SOLUTION: A composition obtained by adding a catalytic amount of gallium acetylacetonate, a silanol and a compound containing an acid anhydride compound to an epoxy compound shows thermosetting properties and provides a thermosetting resin composition having high reliability.