| 摘要 |
The present invention is to prevent overheating without excessively complicating the configuration of the entire control device, or excessively increasing an area of a printed circuit board. Switch ICs, which are IC packages including semiconductor switches for high side operation of a resistive load, are arranged on the printed circuit board. Multiple switch ICs are arranged on the printed circuit board. An overheating prevention component, which is commonly connected to the switch ICs and includes a passive device with a function of blocking or limiting current of the switch ICs to correspond to an increase of the temperature, is installed. The switch ICs are arranged in a way that another switch IC does not exist between each of the switch ICs and the overheating prevention component. |
