| 摘要 |
PROBLEM TO BE SOLVED: To provide an inexpensive and highly reliable circuit board of high density, and a solar cell module, to eliminate a step for removing unnecessary parts when forming a circuit pattern, and to reduce problems due to end face bur of a conductive circuit and peeling of a circuit pattern.SOLUTION: A circuit board includes a back sheet, an adhesive layer, and a metal electrode. The metal electrode includes a first metal electrode, a second metal electrode, and cut pieces between the first metal electrode and second metal electrode. The first metal electrode and second metal electrode are pushed toward the adhesive layer and deformed, and the cut pieces are pushed in the adhesive layer at least partially. |
