| 摘要 |
PROBLEM TO BE SOLVED: To provide a laser bonding method which can achieve cost reduction, a laser bonding device, and a laser-bonded part which is obtained by the laser bonding method.SOLUTION: In a laser bonding method, a first substance and a second substance are laser-bonded to each other by radiating second laser light B being ultrashort pulse laser light to a point in which first laser light A is radiated while radiating the first laser light A being laser light having a pulse width wider than a pulse width of the ultrashort pulse laser light, or laser light having continuous waves to a region in which the first substance 16 and the second substance 17 contact with each other or approximate each other. The intensity of the second laser light B is laser intensity within a range in which the first substance 16 and the second substance 17 cannot be bonded to each other when the second laser light B is singly radiated. |
