| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor element housing package and a semiconductor device capable of reducing mechanical influences received by a semiconductor element when a semiconductor device is fixed to an external mounting substrate.SOLUTION: A semiconductor element housing package comprises a substrate 2, a frame body 3, and input/output terminals 4. The substrate 2 has a mounting region 2b for mounting a semiconductor element 5 at a central part of a square shape, and has U-shaped holes 2c at four corners. The frame body 3 is provided on an upper surface of the substrate 2 so as to surround the mounting region 2b in a square shape, and has through-holes H formed so as to be contacted with the substrate 2 in inward/outward directions of four surfaces respectively. Each input/output terminal 4 is fitted to the through-holes H, and a conductor 4c for making the inside and the outside of the frame body 3 conductive is inserted in an insulator. By providing the input/output terminals 4a at projection parts 2a with holes 2c, of the substrate 2, deformation generated in the mounting region 2b of the substrate 2 at package mounting can be reduced. |
