发明名称 HIGH DENSITY POLYETHYLENE RESIN PARTICLE, COMPOUND RESIN PARTICLE, FOAM PARTICLE, AND FOAM MOLDED BODY
摘要 PROBLEM TO BE SOLVED: To provide seed particles capable of further improving impact resistance at a high magnification without greatly decreasing heat resistance and slow-burning properties of a foam molded body.SOLUTION: High density polyethylene resin particles used for seed particles when polymerizing into seeds includes a mixed resin having the seed particles composed of 100 pts.wt. of a high density polyethylene and 20-100 pts.wt. of an ethylene copolymer where the high density polyethylene has a density of 935-960 kg/mand a softening point of 115-130°C, the ethylene copolymer is a copolymer of an ester monomer selected from acrylic acid alkyl ester and aliphatic saturated mono-carboxylic acid vinyl ester with ethylene, has 1-20 wt.% of a constituent derived from the ester monomer, and has a softening point of 75-110°C, the acrylic acid alkyl ester is selected from methyl acrylate and ethyl acrylate, and the aliphatic mono-carboxylic acid vinyl ester is selected from vinyl acetate and vinyl propionate.
申请公布号 JP2015189912(A) 申请公布日期 2015.11.02
申请号 JP20140069591 申请日期 2014.03.28
申请人 SEKISUI PLASTICS CO LTD 发明人 OWAKI KOKI;GONDO YUICHI
分类号 C08J3/12;C08J9/18;C08J9/228 主分类号 C08J3/12
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