| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor wafer, the warpage of which is suppressed by setting the parameters of a semiconductor substrate, such as the radius and thickness, variably, and to provide a method of manufacturing a light-receiving sensor, the light-receiving sensor, and the like.SOLUTION: A semiconductor wafer has a semiconductor substrate 100, a dielectric multilayer film 110 formed on the semiconductor substrate 100, and becoming the optical filter of a light-receiving sensor 140, and a light detection area 120 formed on the semiconductor substrate 100. When the poisson ratio of the semiconductor substrate 100 is VS, the Young's modulus is ES, the radius is r, the thickness is b, the stress of the dielectric multilayer film 110 is &sgr;, and the thickness is d, following relationship is satisfied; 1.0×10≥{3×r×d×(1-VS)×&sgr;}/(ES×b). |
