发明名称 THERMOSETTING RESIN COMPOSITION, RESIN SHEET, PREPREG AND LAMINATE SHEET
摘要 PROBLEM TO BE SOLVED: To provide a resin composition high in heat-conductivity and excellent in insulation properties at high temperature, a resin sheet, a prepreg and a laminate sheet.SOLUTION: There is provided a thermosetting resin composition containing: a polyfunctional epoxy resin monomer; a polyfunctional amine compound; an inorganic filler (A) which is an aggregate of primary particles and has an average particle diameter d1 of 10 μm to 70 μm; and an inorganic filler (B) containing an inorganic filler(b) having an average particle diameter d3 of particle unit of 1 μm or more and less than 10 μm and an inorganic filler (c) having an average particle diameter d4 of 0.1 μm or more and less than 1 μm. A volume ratio of the (b) : the (c) is 90:10 to 70:30. A percentage content of the (A) to a total solid content is 10 to 55 vol.%, and a percentage content of (B) to the total solid content is 10 to 55 vol.%. The total percentage content of the (A) and the (B) is 30 to 80 vol.%.
申请公布号 JP2015189884(A) 申请公布日期 2015.11.02
申请号 JP20140069022 申请日期 2014.03.28
申请人 HITACHI CHEMICAL CO LTD 发明人 ITO GEN;NISHIYAMA TOMOO;TAKASE YUJI;WAKIGUCHI KEITA
分类号 C08G59/50;B32B27/04;C08J5/18;C08J5/24;C08L63/00 主分类号 C08G59/50
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