发明名称 ADHESIVE FILM WOUND BODY, METHOD FOR PRODUCING CONNECTION BODY AND METHOD FOR CONNECTING ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To suppress the squeeze-out of a binder resin component caused by the stress of tight-winding even in the case the tight-winding is produced by tension upon the pulling-up of an adhesive film, i.e., to prevent the generation of blocking.SOLUTION: Provided is an adhesive film having: an adhesive film 20; a base material film 30; and a resin layer 31 supported to the base film 30 and plastically deformed, including a stress relaxation film 5 connected with the adhesive film 20 and relaxing stress by the tight-winding of the adhesive film 20 and a reel member 3, and the adhesive film 20 is wound around the reel member 3 via the relaxation film 5.
申请公布号 JP2015189836(A) 申请公布日期 2015.11.02
申请号 JP20140067169 申请日期 2014.03.27
申请人 DEXERIALS CORP 发明人 YOSHIMOTO RYUSUKE;HIRAI RYUICHI
分类号 C09J7/02;B65H75/14;C09J5/00;H05K3/32;H05K3/36 主分类号 C09J7/02
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