发明名称 THERMOSETTING RESIN COMPOSITION AND CURED PRODUCT OF THE SAME, SUBSTRATE FOR MOUNTING OPTICAL SEMICONDUCTOR ELEMENT, AND OPTICAL SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a thermosetting resin composition for a reflector formed on a substrate of an optical semiconductor device capable of forming a cured product having excellent preservability, rapid curing rate, excellent light reflectivity, heat resistance and light resistance, low linear expansion coefficient and excellent releasability from a mold.SOLUTION: There is provided a thermosetting resin composition which comprises an epoxy resin (A) represented by the formula (I), a curing agent (B), a curing accelerator (C) which is an ionically bonded material of a phosphonium ion and a halogen anion and a white pigment(D). [Rrepresents an epoxy group, the formulas (1b) and (1c); provided that at least one of which is an epoxy group.]
申请公布号 JP2015189932(A) 申请公布日期 2015.11.02
申请号 JP20140070157 申请日期 2014.03.28
申请人 DAICEL CORP 发明人 YOSHIDA TSUKASA;ADACHI YOSHIAKI;OISHI SATOSHI
分类号 C08G59/20;C08K3/22;C08K3/36;C08K7/02;C08L63/00;H01L33/60 主分类号 C08G59/20
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